Outokumpu has undertaken extensive research and development over the past few years to develop a new hydrometallurgical process, called HydroCopper, to process various kinds of copper concentrate. The company reports that HydroCopper can considerably reduce the operating and capital costs of copper production.

The process is an environmentally sound technology that produces as an intermediate product copper powder, which, Outokumpu says, "is chemically better than LME A-Grade cathode." The best way to use the process is to melt and cast this powder directly to more added value copper rod, using, for example, Outokumpu Upcast technology. The process can, however, be adapted to produce other fabricated copper products as well. Low energy consumption together with good silver and gold yields bring further benefits to producers. The process does not produce sulphuric acid.

HydroCopper is a patented chloride-based process, most suitable for annual capacities ranging from 20,000 t to 150,000 t of copper. The technology was pilot-tested during 2000 and 2001 in Outokumpu's research centre in Pori, Finland. Outokumpu is now building a demonstration plant in Pori. The plant will produce 1 t/d of copper, and will be ready for operation by the end of 2002. Discussions on the first production scale plant have been initiated with several potential partners.

In a separate development, Outokumpu has signed a Framework Agreement with Codeico "on co-operation and development in technology intensive projects to be executed by Codeico in Chile, in the joint participation in projects related to mineral processing, smelting and refining in Chile or in third countries, such as China and Russia, and in technology development projects."

Contact:
Erkki Ryynanen
vice president, business development
Outokumpu Technology
Tel: +358 9 4212762
Fax: 421 3891
erkki.ryynanen@
outokumpu.com
Markku Kyto
vice president, technology
Outokumpu Technology
Tel: +358 9 4212410
Fax: 4213891
markku.kyto@
outokumpu.com

Source:
Mining Magazine, May 2002, p.254

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